沉积温度对Ti-B-N复合薄膜微结构及力学性能的影响  

EFFECTS OF DEPOSITION TEMPERATURE ON MICROSTRUCTURE AND MECHANICAL PROPERTY OF Ti B N COMPOSITE FILM

作　　者：李戈扬[1,2] 王纪文[1,2] 王公耀 王永瑞 李鹏兴[1,2] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室 [2]上海交通大学高温材料及高温测试教育部开放实验室

出　　处：《微细加工技术》1998年第4期52-57,共6页Microfabrication Technology

基　　金：上海交通大学高温材料及高温测试教育部开放实验室资助

摘　　要：采用多靶轮流溅射技术，用Ｔｉ和六方氮化硼（ｈ－ＢＮ）反应合成了Ｔｉ－Ｂ－Ｎ薄膜，采用ＸＲＤ、ＴＥＭ和显微硬度计研究了薄膜的微结构及其力学性能。结果表明，室温下沉积的Ｔｉ－Ｂ－Ｎ薄膜为非晶体的Ｔｉ（Ｎ，Ｂ）化合物，其硬度达到ＨＫ２４７０；高温下沉积的薄膜为ＴｉＮ结构类型的Ｔｉ（Ｎ，Ｂ）晶体，薄膜在晶化后硬度略有降低。In this paper , Ti B N composite film was synthesized by Ti and h BN in alternative deposition through substrate rotation in multi target magnetron sputtering system. The microstructure and mechanical property of composite film were studied by XRD, TEM and microindentor. The results showed that in the film deposited at ambient temperature there exists an amorphous phase of Ti(N,B) compound and its hardness reaches HK2470. The film deposited at high temperature consists of Ti(N,B) crystal and mainly exists in TiN like structure and its hardness decreases a little after crystallization.

关 键 词：复合薄膜 多靶磁控溅射 微结构 钛 硼 氮 

分 类 号：TN305.92[电子电信—物理电子学] O484.1[理学—固体物理]