电子封装模具设计研究现状及进展  

Research Actuality and Advance of Design of Plastic Package Mould for Electronics

作　　者：杨良波[1] 周起雄[1] 钱心远[1] 刘方辉[1] 高雪芹[1] 张杰[1] 

机构地区：[1]四川大学高分子科学与工程学院高分子材料工程国家重点实验室,四川成都610065

出　　处：《塑料科技》2009年第10期88-93,共6页Plastics Science and Technology

基　　金：国家自然科学基金(50873072;50803038);国家基础研究专项经费(2005CB623800);国家重点实验室专项经费联合资助

摘　　要：介绍了塑料封装模具在集成电路、半导体、芯片等电子产品中的应用,重点讨论了塑料封装模具的分类、组成和设计要点,比较了注塑模具和塑料封装模具的区别,展望了塑料封装模具的发展方向。The application of plastic package mould in the electronic products,such as integrated circuit,semiconductor,chip,and etc.,was introduced. The classification,composition and key design points of plastic package mould were discussed in detail. The difference between commom injection mould and plastic package mould was compared. The development direction of the plastic package mould was predicted.

关 键 词：塑料封装模具 电子产品 研究进展 

分 类 号：TG76[金属学及工艺—刀具与模具]