PBGA封装的耐湿热可靠性试验研究  

Reliability Analysis of PBGA Devices at Hygrothermal Environment

作　　者：周鹏[1] 蒋廷彪[1] 农红密[1] 

机构地区：[1]桂林电子科技大学,广西桂林541004

出　　处：《半导体技术》2009年第10期942-945,共4页Semiconductor Technology

基　　金：国家自然科学基金资助项目(60666002)

摘　　要：塑封电子器件作为一种微电子封装结构形式得到了广泛的应用,因此湿热环境下塑封电子器件的界面可靠性也越来越受到人们的关注。为了研究塑封器件及其所用材料在高湿和炎热(典型的热带环境)条件下的可靠性,采用耐湿温度循环的试验方法,以塑封球栅平面阵列封装(PBGA)器件为例进行测试。试验结果表明,芯片是最容易产生裂纹的地方,试验后期器件产生的裂纹主要出现在芯片和DA材料界面处及芯片、DA材料和EMC材料三种材料的交界处。空洞缺陷是使界面层间开裂的主要原因,在高温产生的蒸汽压力和热机械应力的作用下,界面上的微孔洞扩张并结合起来,导致器件最后失效。As the plastic electronic packages the interface reliability at hygrothermal environment are widely used in microelectronics packaging structures, is attracting more and more attention. In order to research the reliability of the plastic electronic packages and its materials under high humidity and hot condition, the reliability of humidity temperature circulation in plastic ball grid array （PBGA） devices was tested. The results show that the cracks mainly appearance at the interface between die-attach （DA） material and the chip; and at the interface of chips, DA and epoxy molding compound （EMC） materials. Voids defect are the main reason of the interface crack. The vapor pressure and thermo-mechanieal stress induced under high temperature lead to the cavity defect in the interface expand and finally crack.

关 键 词：湿热 可靠性 界面层裂 电子元件 空洞缺陷 

分 类 号：TN305.94[电子电信—物理电子学]