利用俄歇电子能谱仪研究Al焊垫表面的F腐蚀  

Study on Fluorine Induced Aluminum Bonding Pads Corrosions Using Auger Electron Spectroscopy

作　　者：齐瑞娟 虞勤琴 段淑卿 王玉科 李明 郭强 

机构地区：[1]中芯国际半导体制造(上海)有限公司,上海201203

出　　处：《半导体技术》2009年第10期1006-1010,共5页Semiconductor Technology

摘　　要：Al焊垫的质量关系着半导体器件及封装的质量和可靠性。多项研究表明Al焊垫表面的沾污增强了Al焊垫腐蚀的可能性,特别是焊垫表面刻蚀后残留的F元素,极容易在焊垫表面引起各种类型得腐蚀。应用俄歇电子能谱仪,研究了两种发生在焊垫表面的腐蚀现象,结合其他失效分析手段,分析了Al焊垫表面的F腐蚀的成因。研究结果表明,被腐蚀的Al焊垫表面F元素的相对含量较高,腐蚀缺陷所在区域的氧化层大为加厚,将直接影响到后期封装过程中Al和相应封装材料的金属键合,造成潜在的芯片失效。Aluminum bonding pads play a key role on the quality and reliability during the testing and packaging of semiconductor devices. Many studies show that residue on the pads will strongly enhance the possibility of pads corrosions. Especially fluorine on after pads etching will easily lead to multiform corrosions on the pads. Two kinds of bonding pads corrosions were studied. Combined with other failure analysis techniques, the applications of Auger electron spectroscopy in the analysis of fluorine-induced bonding pads corrosion were presented. In addition, the formation mechanism of fluorine induced pads corrosions was studied. The results show that the fluorine concentration of the corroded bonding pads is much higher than the good ones. Also, the alumina at the corroded area of the aluminum bonding pads is much thicker which might influence the bonding of aluminum to the package materials and leads to the potential failure of the devices.

关 键 词：铝焊垫 俄歇电子能谱仪 氟腐蚀 失效分析 

分 类 号：TN305.94[电子电信—物理电子学]