高强高导铜铌微观复合材料的微观结构与性能  

Microstructure and Properties of High Strength and High Conductivity Cu-Nb Microcomposite

作　　者：梁明[1,2] 陈自力[2] 卢亚锋[2] 李成山[2] 闫果[2] 李金山[1] 张平祥[1,2] 

机构地区：[1]西北工业大学凝固技术国家重点实验室,陕西西安710068 [2]西北有色金属研究院,陕西西安710016

出　　处：《稀有金属材料与工程》2009年第10期1774-1777,共4页Rare Metal Materials and Engineering

基　　金：国家"863"科技计划课题(2007AA03Z513)

摘　　要：采用集束拉拔制备技术获得了含有N=854铌芯的Cu-Nb微观复合材料。在77K条件下材料的电阻率为0.36μΩ·cm,在293K时,复合材料导电率大于70%IACS。复合材料截面面积大于5mm2时,复合材料室温抗拉强度达到915MPa。通过扫描电镜观察了材料拉伸断口形貌及芯丝排布情况。Cu-Nb microcomposite wire materials containing N=85^4 niobium filaments were prepared by bundling and drawing technique. The electrical resistivity of the materials is 0.36 μΩ·cm at 77 K. The conductivity values could be greater than 70%IACS at 293 K. The ultimate tensile strength could reach 915 MPa at room temperature when the sectional area of the materials was larger than 5 mm2. And the fracture surface morphology and the Nb filaments arrangement of Cu-Nb wires were observed by SEM.

关 键 词：集束拉拔 CU-NB 抗拉强度 电阻率 

分 类 号：TB33[一般工业技术—材料科学与工程]