废旧线路板粉料作为BMC填料的正交试验研究  

Orthogonal Experimental Studies on Preparation of BMC Using Waste Printed Circuit Board Powder as Filler

作　　者：戎国林[1] 刘学平[1] 

机构地区：[1]清华大学深圳研究生院先进制造技术研究所,广东深圳518055

出　　处：《当代化工》2009年第4期329-331,351,共4页Contemporary Chemical Industry

基　　金：国家科技支撑计划(绿色制造关键技术与装备);电子电器无害化工艺技术及装备;项目编号2006BAF02A07

摘　　要：将废旧线路板回收处理过程中得到的粉料作为填料,采用模压成型的方法制备成BMC(预制团状模塑料)复合材料。通过正交试验确定BMC材料中不饱和聚酯树脂、短切玻纤和废旧线路板粉料的最优配比,同时得到树脂、粉料及玻纤加入量对BMC材料性能的影响。结果表明:当加入30份的短切玻纤、45份的废旧线路板粉料和30份的不饱和聚酯树脂时,制备的材料综合性能达到最优,弯曲强度和压缩强度可达63.8MPa、101.5MPa。The powder recycling from the waste printed circuit board was used to prepare BMC as filler by the method of compression molding. By orthogonal test, the optimal ratio of unsaturated polyester resins, glass fiber and waste printed circuit board powder in BMC was determined, and effects of content of resin, filler and glass fiber on the mechanical properties of BMC were studied. The results show that：When adding 30 copies of chopped glass fiber, 45 copies of the waste printed circuit board powder and 30 copies of the unsaturated polyester resins, the materials has optimal performance, flexural strength and compressive strength are up to 63.8 MPa and 101.5 MPa.

关 键 词：废旧线路板 模压成型 预制团状模塑料 力学性能 

分 类 号：TQ320.9[化学工程—合成树脂塑料工业]