Overall optimization of high-speed semiconductor laser modules  

作　　者：LIU Yu CHEN ShuoFu WANG Xin YUAN HaiQing XIE Liang ZHU NingHua 

机构地区：[1]Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

出　　处：《Chinese Science Bulletin》2009年第20期3697-3703,共7页

基　　金：Supported by the National Natural Science Foundation of China (Grant Nos. 60820106004, 60536010, 60606019, 60777029 and 60837001);National High Technology Research and Development Program of China (Grant No. 2009AA03Z409);Major International Cooperation Projects of China (Grant No. 2006dfa11880)

摘　　要：Based on the high frequency techniques such as frequency response measurement,equivalent circuit modeling and packaging parasitics compensation,a comprehensive optimization method for packaging high-speed semiconductor laser module is presented in this paper.The experiments show that the small-signal magnitude frequency response of the TO packaged laser module is superior to that of laser diode in frequencies,and the in-band flatness and the phase-frequency linearity are also improved significantly.Based on the high frequency techniques such as frequency response measurement, equivalent circuit modeling and packaging parasitics compensation, a comprehensive optimization method for packaging high-speed semiconductor laser module is presented in this paper. The experiments show that the small-signal magnitude frequency response of the TO packaged laser module is superior to that of laser diode in frequencies, and the in-band flatness and the phase-frequency linearity are also improved significantly.

关 键 词：激光模块 半导体 整体优化 频率响应测量 等效电路模型 综合优化方法 激光二极管 高频技术 

分 类 号：TN929.1[电子电信—通信与信息系统] TN304.23[电子电信—信息与通信工程]