纳米压痕试验确定80Au/20Sn焊料蠕变参数  

Determination of Creep Parameters of 80Au/20Sn Solder by Nanoindentation

作　　者：张国尚[1] 荆洪阳[1] 徐连勇[1] 魏军 韩永典[1] 

机构地区：[1]天津大学材料科学与工程学院天津市现代连接技术重点实验室,天津300072 [2]新加坡制造技术研究院,新加坡638075

出　　处：《稀有金属》2009年第5期680-685,共6页Chinese Journal of Rare Metals

基　　金：国家自然科学基金项目(50575160);教育部高等学校博士点基金项目(20050056035)资助

摘　　要：80Au/20Sn焊料合金被广泛用于微电子及光电子封装中,其焊料的蠕变性能对于器件的长期运行至关重要。描述蠕变行为的蠕变参数,对于求解蠕变本构模型及分析蠕变机制具有重要意义。在不同加载速率及不同温度下对80Au/20Sn焊料进行了恒加载速率/载荷纳米压痕试验,用半椭圆模型对出现"挤出"压痕的接触面积修正后由Oliver-Pharr法求得了不同温度下的弹性模量及硬度,基于压痕做功概念获得了蠕变参数。结果表明,基于压痕做功概念得到的蠕变应力指数和蠕变激活能与传统单轴拉伸蠕变测试结果相差在13%以内,说明该测试和分析方法能在一定程度上预测焊料的蠕变参数。80Au/20Sn solder alloy was widely used in micro-electronic and optoelectronic packaging, the creep property of the alloy was very important for longer operating lifetime of apparatus. The creep parameters describing the creep behaviour were of great importance for developing a constitutive model and to analyze the creep mechanism. In this study, nanoindent- ation tests were performed using constant loading rate/ constant load method at temperatures. The elastic different loading rates and modulus and hardness were acquired using the Oliver-Pharr method after the contact areas were modified based on the semi-ellipse method for the pile up indentation. The difference of the creep stress exponent and creep activation energy obtained between nanoindentation test based on the concept of ＂work of indentation＂ and the conventional uniaxial tensile creep tests was below 13%. It implied that nanoindentation test and analysis method could be used to evaluate the creep parameters of solder alloys to some extent.

关 键 词：蠕变参数 单轴拉伸蠕变 纳米压痕 压痕功 

分 类 号：TG115.56[金属学及工艺—物理冶金]