植酸在铜基表面缓蚀性能电化学研究  

The corrosion inhibition study of phytic acid on different copper surface by electrochemistry

作　　者：顾玮婧[1] 王莉燕[1] 王馨迪[1] 范士杰[1] 张燕[1] 杨海峰[1] 

机构地区：[1]上海师范大学生命与环境科学学院,上海200234

出　　处：《上海师范大学学报（自然科学版）》2009年第5期501-505,共5页Journal of Shanghai Normal University(Natural Sciences)

基　　金：上海市大学生创新活动计划项目(CH028)

摘　　要：报道了将对环境友好的植酸化合物自组装修饰于铜基电极表面,进行了电化学极化曲线实验,获得了最佳组装实验条件.实验证明:植酸在较低浓度下组装,对于纯铜与黄铜均提高了缓蚀性能,尤其对于合金如黄铜成效显著.同时,在腐蚀液环境中,经交流阻抗分析,解析了植酸组装层的缓蚀机理.Phytic acid, as an environment friendly corrosion inhibitor, can be self-assembled onto the surface of copper- based electrode. The optimized parameters of the self-assembly are determined by using tile electrochemical polarization experiments. The electrochemical polarization experimental data show that the corrosion inhibition effect can be realized by the assembly in the low concentration of phytic acid solution for due time, especially for brass. Electrochemical impedance data elucidate the mechanisms of corrosion inhibition of phytic acid monolayers at various copper-based surfaces.

关 键 词：植酸 铜基电极 极化曲线 交流阻抗 缓蚀性能 

分 类 号：O657.1[理学—分析化学]