工程陶瓷的磨削钻孔及表面形成机理  

Drilling and forming mechanisms of ground surfaces in engineering ceramics

作　　者：郑雷[1] 冯宝富[1] 王保卫[1] 袁军堂[2] 汪振华[2] 

机构地区：[1]鲁东大学先进制造与自动化技术重点实验室,山东烟台264025 [2]南京理工大学机械工程学院,南京210094

出　　处：《粉末冶金技术》2009年第5期351-355,360,共6页Powder Metallurgy Technology

基　　金："十一五"国防预研基金资助项目

摘　　要：结合工程陶瓷的加工特性,采用特定组份的铜基结合剂烧结金刚石钻头对其进行孔加工试验研究。结合剂体积分数为48%Cu、30%Co、6%N i、5%WC、5%Ti、4%Sn、2%Cr。根据烧结金刚石钻头的磨削加工特点,导出了唇面单颗金刚石磨粒的平均载荷的计算公式;在此基础上,结合陶瓷磨削表面的扫描电镜观察,分析了金刚石钻头磨削钻孔的陶瓷材料去除机理。结果表明,在试验条件下,陶瓷材料虽然以脆性断裂去除为主,但也有部分材料发生塑性变形去除。The specially sintered diamond bits were developed for drilling engineering ceramics with composition （vol%） of bond matrix being48% Cu, 30% Co, 6% Ni, 5% WC, 5% Ti, 4% Sn and 2% Cr. In view of the abrasive machining characteristics, the calculation expression of mean load per diamond on the lip face were set up, and accordingly the forming mechanism of ceramic ground surface was presented. Through SEM observations of ceramic ground surfaces, the material removal mechanisms were analyzed and verified. The results show that most of ceramic ground surfaces are formed through brittle fracture and few through ductile deformation.

关 键 词：工程陶瓷 烧结金刚石钻头 钻孔工艺 表面形成机理 

分 类 号：TG580.6[金属学及工艺—金属切削加工及机床] TQ174.64[化学工程—陶瓷工业]