微晶玻璃低温脆塑转变机理的研究  

Mechanism of Brittle-ductile Transition of Glass-ceramics at Low Temperature

作　　者：周亮[1] 左敦稳[1] 孙玉利[1] 朱永伟[1] 

机构地区：[1]南京航空航天大学机电学院,南京210016

出　　处：《硅酸盐通报》2009年第5期1029-1032,1037,共5页Bulletin of the Chinese Ceramic Society

基　　金：国家自然科学基金资助项目(No:50675104);江苏省六大人才高峰基金(No:06-D-024);江苏省博士后科研资助计划项目(0901035C);中国博士后科学基金资助(200904501095)

摘　　要：微晶玻璃是一种新型的硬盘基板材料,目前大多采用超精密研磨和抛光进行加工。本文针对微晶玻璃低温抛光加工过程,研究了低温条件下微晶玻璃的脆塑转变机理,采用维氏硬度计研究了微晶玻璃在不同温度下的硬度以及裂纹的产生、扩展及特征,分析了温度对微晶玻璃脆塑转变的影响。结果表明:不同温度下,随着载荷的增加,微晶玻璃都经历了从塑性变形到脆性断裂的转变过程;随着温度的降低,微晶玻璃的显微硬度逐渐增加而裂纹长度减小。Glass-ceramic is a new kind of substrate for hard disk of computer. In recent years, the mostly used ultra-precision machining methods are lapping and polishing. In this paper, the mechanism of brittle-ductile transition of glass-ceramics at different low temperatures was studied. Formation, propagation, length of crack and hardness of glass-ceramics were investigated at different temperature by means of Vickers indentation. The effect of temperature on the mechanism of its brittle-ductile transition was analyzed. Results show that with the increase of load at different temperatures, glass-ceramic goes through the ductile to brittle transition. Besides, with the decrease of temperature its hardness increases gradually, and the length of crack decreases.

关 键 词：微晶玻璃 低温 压痕法 脆塑转变 

分 类 号：TU528[建筑科学—建筑技术科学]