电解修整精密镜面磨削工件表面形态及切屑形成理论解析  

Surface Finish and Chip Formation Resulting from Electrolytic In Process Grinding

作　　者：王平[1] 唐一平[1] 卢秉恒[1] 韩荣久[2] 

机构地区：[1]西安交通大学 [2]中科院长春光机所

出　　处：《西安交通大学学报》1998年第10期39-42,共4页Journal of Xi'an Jiaotong University

基　　金：国家自然科学基金

摘　　要：研究了硬脆材料与电解修整磨削（ＥｌｅｃｔｒｏｌｙｔｉｃＩｎＰｒｏｃｅｓＧｒｉｎｄｉｎｇ，ＥＬＩＤ）超精密镜面磨削过程中的诸多现象，特别是对工件表面微观形态进行了研究，研究结果表明超精密镜面的微刃磨削在工件表面形成的磨痕不同于普通磨削，即工件表面材料是经过微细磨料的数次碾压、剪切、位错、滑移造成表面材料质量团累积塑性损伤，脱离材料表面层而形成切屑的．建立了微细切屑的塑性损伤形成力学模型，并进行了解析，结论适用于硬脆材料的韧性（Ｄｕｃｔｉｌｅ）超精密磨削条件及研磨、抛光工艺过程．Electrolytic in process grinding (ELID) is an ultraprecision process in mirror like surface finish;it can be applied to hard brittle and ductile materials.Unlike the normal grinding process,various mechanism of repeated crush,shearing,dislocation and slip by micro abrasive take place in ELID.Chip on the workpiece surface is formed as a result of plastic damage accumulation.A mechanics model is developed in analyzing the phenomenon of microchip formation; it can be applied to examine the process of ultraprecision grinding as well as lapping and polishing.

关 键 词：超精密 镜面磨削 切屑形成 损伤理论 ELID 

分 类 号：TG580.613[金属学及工艺—金属切削加工及机床]