固结磨料研磨与抛光的研究现状与展望  

Fixed abrasive lapping and polishing:present situation and prospect

作　　者：李立明[1] 李茂[2] 朱永伟[2] 

机构地区：[1]郑州电力高等专科学校机电工程系,河南郑州450004 [2]南京航空航天大学机电学院,江苏南京210016

出　　处：《金刚石与磨料磨具工程》2009年第5期17-22,共6页Diamond & Abrasives Engineering

基　　金：国家自然科学基金(50675104);江苏省六大人才高峰基金(06-D-024);江苏省精密与微细制造技术重点实验室基金(JSPM200707)资助项目

摘　　要：分析了传统游离磨料研磨抛光存在的缺点和固结磨料的研磨抛光的优点;阐述了固结磨料研磨抛光的材料去除机制以及固结磨料研磨盘抛光技术在氮化硅陶瓷加工、半导体制程中的应用;介绍了多种固结磨料研磨盘、抛光垫的制作方法;并展望了固结磨料的研磨抛光的发展趋势。The shortcomings of conventional lapping and polishing technologies were analyzed. The material removal mechanism of fixed-abrasive lapping and polishing technologies was presented, and the applications of this technology in silicon nitride ceramics processing and semiconductor manufacture process were discussed. Some methods of preparing fixed abrasive pad were suggested. Finally, the developing trends of fixed abrasive lapping and polishing were discussed.

关 键 词：固结磨料 抛光垫 研磨 抛光 

分 类 号：TG58[金属学及工艺—金属切削加工及机床] TG74