膜组件浇铸用室温固化环氧树脂耐热胶粘剂的研究  

Study of heat-resistant epoxy adhesives cured at room temperature for the preparation of membrane modules

作　　者：马琳[1] 吕晓龙[1] 武春瑞[1] 贾悦[1] 王暄[1] 

机构地区：[1]天津工业大学生物化工研究所,天津300160

出　　处：《膜科学与技术》2009年第5期66-69,共4页Membrane Science and Technology

基　　金：国家科技支撑计划项目(2006BAB03A06);863课题(2008AA06Z303)

摘　　要：针对耐高温膜组件的浇铸,研制了可室温固化环氧树脂耐热胶粘剂.探讨了环氧树脂、固化剂的种类以及固化剂和稀释剂添加量对胶粘剂性能的影响.考察了胶粘剂的粘接性能,并通过差示量热扫描仪(DSC)分析了固化反应过程中的放热情况及固化产物的耐热性.结果表明:双酚F树脂与A105固化剂配制的胶粘剂耐热性好,黏度低,粘接性能优良,当固化剂质量分数为28%时,固化物的玻璃化温度Tg可达91℃.An epoxy resin adhesive which can cure at room temperature and possesses excellent thermal stability was developed for the purpose of high temperature- resistant membrane module preparation. The effects of the type and chemical structure of the epoxy resin, curing agent and different dosage of curing agent and diluent a- gent on the capability of condensate of epoxy resin adhesive were studied. The adhesive bonding properties were investigated, the heat coming from the curing reaction process and the heat - resistance of the product cured were analyzed by Differential Scanning Calorimetry （DSC）. The results indicate that the epoxy resin dope of Bisphenol F resin and A105 curing agent had lower viscosity and excellent bonding properties as well as better heat- resistantce; the Tg is 91℃ when the A105/EP mass ratio is 28/100.

关 键 词：胶粘剂 环氧树脂 膜组件 耐热性 

分 类 号：TQ433.437[化学工程]