印制电路板拆解技术与拆解工艺综述  

Disassembly Technology and Disassembly Process of Waste Printed Circuit Boards:a State-of-the-art

作　　者：杨继平[1,2] 向东[1] 高鹏[1] 汪劲松[1] 段广洪[1] 杨继荣[3] 

机构地区：[1]清华大学精密仪器与机械学系,北京100084 [2]后勤工程学院供油工程系,重庆400016 [3]湖南文理学院机械工程学院,常德415000

出　　处：《机械工程学报》2009年第9期126-135,共10页Journal of Mechanical Engineering

基　　金：国家科技支撑计划(2006BAF02A16);重庆市科技攻关(CSTC;2007AC2063)资助项目

摘　　要：综述了电路板拆解单元技术、工艺和设备等方面的研究现状与进展。按照电路板拆解的过程顺序,分别从元器件的识别与定位、电路板解焊技术、拆解施力方式、元器件与焊锡的分离、收集与分类等5项单元技术方面描述了近年来的技术现状与发展;在分析各种拆解工艺和设备的基础上,根据拆解目的和拆解方法的不同,分选择性拆解工艺与设备、面向材料回收的同时性拆解工艺与设备、面向元器件功能重用的同时性拆解工艺与设备、混合拆解工艺与设备等4个方面对当前的各种拆解工艺和设备进行了综合与分类。最后指出,电路板拆解在采用新方法的拆解单元技术、电路板拆解机理分析、更加经济实用、环保、快速的拆解工艺和装备等方面有待进一步研究与开发。The research status and progress in the field of disassembling unit technologies, processes and equipment of printed circuit boards （PCBs） are reviewed According to the disassembly process order, the technical status and progress in five unit technologies are described, i.e. identification and location of components, unsoldering technology, mode of disassembling force application, separation of component and tin solder, collection and classification. On the basis of analysis of various disassembling processes and equipment, according to different goals and disassembly methods, four kinds of disassembly process and equipment are classified and discussed in detail, i.e. selective disassembling, simultaneous disassembling for material recycling, simultaneous disassembling for component function reuse, and hybrid disassembling. Finally it is pointed out that further research and development should be carded out in aspects of adopting new methods for disassembling unit technologies, analysis of PCB disassembly mechanism, and developing more economical, practical, environment-friendly and quick disassembling process and equipment.

关 键 词：废旧电路板 印制电路板 拆解 电子元器件 回收 

分 类 号：X705[环境科学与工程—环境工程]