用于半导体探测器研制的数字影像显微系统  

The System of Digital-image Optical Microscope in Semiconductor Particle Detector Development

作　　者：韩励想[1,2] 李占奎[1] 靳根明[1] 王柱生[1] 肖国青[1] 

机构地区：[1]中国科学院近代物理研究所,兰州730000 [2]中国科学院研究生院,北京100049

出　　处：《核电子学与探测技术》2009年第5期945-949,共5页Nuclear Electronics & Detection Technology

摘　　要：光学显微检测在半导体探测器研制的多个环节具有重要意义。利用较低价单元、部件组装了一套数字影像光学显微系统,性能与国外中档产品相当,性价比卓越。该系统拥有微机控制的高清晰数字摄影装置,配置大屏幕监视器,搭载高倍干系物镜,分辨率达到0.2μm,可以进行明暗场、偏光、干涉观测。它可以方便的用于缺陷、沾污控制,图形检测,表面光洁度检验,材料鉴定等方面,还可用于测试、封装、修理等精细操作。通过观察焊点的表面形貌,钎料合金的显微结构,可以鉴定焊点质量。如果结合多光束干涉技术可用于表面起伏的精细测量。论文叙述了该系统在半导体探测器研制上的应用,详述了其建造细节。Optical microscopic detection is very important in the process of semiconductor particle detector development. A system of digital-image optical microscope has been constructed with rather low price, which performance is comparable with the moderate-level imports. The system mounts powerful dry objective, and a 2μm resolution could be achieved. Observations with bright and dark field, polarized light, and interference light can be carried out on it. The system have large area on-line monitor, and the photographic device can be controlled by PC. It can be used in the control of defects and contaminations, pattern test, identification of crystal backing, inspection of the smoothness and the flatness of the crystal surface. It can also be used in some precise procedures, such as test, assembly, packaging and repairing. The quality of the bond could be examined by observing the appearance of the bond point and the microscopic structure of the solder. The surface fluctuation can be precisely measured under the microscope with the technology of multi-beam interference. In the article, the application of this system for semiconductor particle detector development has been illustrated, and the construction information has been described in detail.

关 键 词：半导体探测器IC制造技术 平面工艺 显微镜 数码相机 

分 类 号：TL814[核科学技术—核技术及应用]