高热导率低热膨胀系数Cu-ZrW_2O_8复合材料的制备与性能  

Preparation and properties of Cu-ZrW_2O_8 composites with high thermal conductivity and low thermal expansion coefficient

作　　者：彭卓玮[1] 李劲风[1] 郑子樵[1] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083

出　　处：《粉末冶金材料科学与工程》2009年第5期337-342,共6页Materials Science and Engineering of Powder Metallurgy

基　　金：基础科研项目(A1420060164)

摘　　要：以负热膨胀材料ZrW2O8与金属Cu为原料,分别采用常规烧结法和热压法制备具有高热导率低膨胀系数的新型Cu基复合材料Cu-ZrW2O8,研究ZrW2O8体积分数与烧结方法对该复合材料致密度、热导率及热膨胀系数的影响。结果表明:热压法制备的Cu-50%ZrW2O8复合材料的热导率达173.3W/(m·K),致密度为91.6%,均明显高于常规烧结样品;热压样品的热膨胀系数为11.2×10-6K-1,稍高于常规烧结样品;在150～300℃温度范围内热处理后该样品的平均热膨胀系数降低到10.87×10-6K-1,较纯Cu的平均热膨胀系数17×10-6K-1低很多,有望成为一种新型的电子封装材料。The Cu based composite with low thermal expansion rate and high thermal conductivity has been fabricated by conventional sintering and hot-press methods using ZrW2O8 and Cu as raw materials. The effect of the volume fraction of ZrW2O8 and sintering method on density, thermal conductivity and thermal expansion coefficient of the Cu-ZrW2O8 composites has been studied. The results show that the composite fabricated through hot-press has higher density than that of fabricated through conventional sintering. The Cu-50%ZrW2O5 （volume fraction） composite fabricated through hot-press has a thermal conductivity of 173.3 W/（m-K）, a relative density of 91.6%, and a thermal expansion coefficient of 11.2 ×10^-6 K^-1. The average thermal expansion coefficient （150-300 ℃） of Cu-50vol% ZrW2O8 composite is 10.87×10^-6 K^-1 after heat treatment, which is much lower than that of pure Cu （17 × 10^-6 K^-1）. The Cu-50%ZrW2O8 （volume fraction） composite is expected to become a new type of electronic packaging materials.

关 键 词：负热膨胀 Cu-ZrW2O8复合材料 热压 热导率 热膨胀系数 

分 类 号：TQ174[化学工程—陶瓷工业]