环氧塑封料绿色环保化过程中的问题研究  

Study of Some Problems in Environmental Friendly Improvement of Epoxy Molding Compounds

作　　者：黄文迎[1] 李刚[1] 王善学[1] 周洪涛[1] 

机构地区：[1]北京科化新材料科技有限公司,北京102206

出　　处：《中国集成电路》2009年第11期65-68,共4页China lntegrated Circuit

摘　　要：本文以国内电子封装产业中绿色环保型环氧塑封料的使用情况为背景,通过对其可靠性和工艺成型性的深入分析,结合具体实例的比较,总结出环氧塑封料向高性能和绿色环保方向发展过程中的若干问题,并提出针对这些问题的相关建议。Based on electronic packaging, the applied situations of environmental friendly epoxy molding compounds （EMC） in domestic several problems were concluded on EMC during the improvement process of environmental friend and high performance. These were obtained by analysis of reliability and manufacturability of EMC in typical examples of encapsulation, and the corresponding specific proposal was shown in this paper.

关 键 词：环氧塑封料 塑封料 绿色环保 电子封装材料 

分 类 号：TN05[电子电信—物理电子学]