可穿戴计算机主板振动优化模型研究  

The study on the vibration optimization model of the wearable computer motherboard

作　　者：黄志奇[1] 王厚军[1] 陈东义[1] 

机构地区：[1]电子科技大学移动计算中心,成都610054

出　　处：《电子测量与仪器学报》2009年第10期31-36,共6页Journal of Electronic Measurement and Instrumentation

基　　金：国家863计划(编号:2006AA01Z113)资助项目;国家自然科学基金(编号:60674077;F030208)资助项目;2007国家总装备部武器装备预研基金(编号:9140A16020207020240)资助项目

摘　　要：可穿戴计算机主板的结构尺寸是决定可穿戴计算机抗振性能和可穿戴性能的关键因素。本文针对可穿戴计算机振动设计所具有的特殊性,在对可穿戴计算机主板受迫振动分析和主板固有振动频率分析的基础上,同时考虑其结构尺寸对其可穿戴性能的影响,建立了可穿戴计算机主板振动优化模型。由于无法得到主板固有振动频率的精确解,本文通过仿真试验确立可穿戴计算机主板固有振动频率与其结构尺寸的对应关系。提出"分层细化"的方法,采用多组正交试验方案,以最少的仿真试验次数得到振动优化模型的最优解。The physical dimension of the wearable computer motherboard is key factor which affects the anti-vibration performance and wearability of the wearable computer. Basing on the forced vibration analysis and natural vibration frequency analysis of the wearable computer motherboard, at the same time, the influence on its wearability which caused by its structure size has been considered, the vibration optimization model was established in view of particularity which the anti-vibration design of the wearable computer has. Because we can not obtain the arithmetical solution about natural vibration frequency of the wearabler computer motherboard, the corresponding relationships between natural vibration frequency and physical dimension was set up through simulation experiments. Adopting multibank orthogonal experiment scheme, the paper brought forward a grouping refinement method, so the optimal solution of the vibration optimization model can be get with the least simulation experiments.

关 键 词：可穿戴计算机 振动优化模型 正交试验 

分 类 号：TP368[自动化与计算机技术—计算机系统结构] TP602[自动化与计算机技术—计算机科学与技术]