Growth of High Quality Strained-Si on Ultra-Thin SiGe-on-Insulator Substrate  

作　　者：刘旭焱 刘卫丽 马小波 陈超 宋志棠 林成鲁 

机构地区：[1]State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences, Shanghai 200050 [2]Graduate University of Chinese Academy of Sciences, Beijing 100190

出　　处：《Chinese Physics Letters》2009年第11期156-159,共4页中国物理快报（英文版）

摘　　要：Ultra-thin and near-fully relaxed SiCe substrate is fabricated using a modified Ce condensation technique, and then a 25-nm-thiek biaxially tensile strained-Si with a low rms roughness is epitaxially deposited on a SiGe- on-Insulator （SGOI） substrate by ultra high vacuum chemical vapor deposition （UHVCVD）. High-Resolution cross-sectional transmission electron microscope （HR-XTEM） observations reveal that the strained-Si/SiGe layer is dislocation-free and the atoms at the interface are well aligned. Furthermore, secondary ion mass spectrometry （SIMS） results show a sharp interface between layers and a uniform distribution of Ge in the SiCe layer. One percent in-plane tensile strain in the strained-Si layer is confirmed by ultraviolet （UV） Raman spectra, and the stress maintained even after a 30-s rapid thermal annealing （RTA） process at 1000℃. According to those results, devices based on strained-Si are expected to have a better performance than the conventional ones.Ultra-thin and near-fully relaxed SiCe substrate is fabricated using a modified Ce condensation technique, and then a 25-nm-thiek biaxially tensile strained-Si with a low rms roughness is epitaxially deposited on a SiGe- on-Insulator （SGOI） substrate by ultra high vacuum chemical vapor deposition （UHVCVD）. High-Resolution cross-sectional transmission electron microscope （HR-XTEM） observations reveal that the strained-Si/SiGe layer is dislocation-free and the atoms at the interface are well aligned. Furthermore, secondary ion mass spectrometry （SIMS） results show a sharp interface between layers and a uniform distribution of Ge in the SiCe layer. One percent in-plane tensile strain in the strained-Si layer is confirmed by ultraviolet （UV） Raman spectra, and the stress maintained even after a 30-s rapid thermal annealing （RTA） process at 1000℃. According to those results, devices based on strained-Si are expected to have a better performance than the conventional ones.

分 类 号：TN305[电子电信—物理电子学] TM21[一般工业技术—材料科学与工程]