水射流导引激光钻孔传热分析及数值模拟  

Modeling of Waterjet Guided Laser Drilling of Silicon Based on FVM

作　　者：詹才娟[1] 李昌烽[1] 王育立[1] 

机构地区：[1]江苏大学能源与动力工程学院,江苏镇江212013

出　　处：《应用激光》2009年第5期415-418,422,共5页Applied Laser

基　　金：国家自然科学基金资助项目(项目编号:10672069);教育部留学回国人员科研启动基金资助项目(外教司留[2008]890号)

摘　　要：水射流导引激光加工是一种新型的加工技术,结合了激光加工和水射流加工的优点,其中高速微水射流像"液体光纤"一样来导引激光束,具有更加优异的加工性能,更高的加工精度和质量。将钻孔过程分为三个阶段,基于有限体积法建立了水射流导引激光束对硅工件进行钻孔的传热模型,模拟了水射流导引激光钻孔过程中的热量传递,相变过程和动边界的传递过程。结果表明:工件上最高温度出现在壁面以下区域;射流在激光加工中有强冷却作用,明显减小了热影响区。Waterjet guided laser processing is a new technique. The process combines the advantages of laser processing with those of waterjet cutting. The technique based on guiding a laser beam inside a thin, high-speed waterjet. It is very suitable in processing thin and sensitive material with a high degree of precision required. A heat transfer model based on FVM for waterjet guided laser drilling on a silicon substrate is presented in this study. The model treats the continuous process as three stages. The model represents the heat transfer, state changing and moving boundary in detail. The results show that a high-temperature region exists just blow the surface, the high cooling effect performs by waterjet can reduces heat affect zone.

关 键 词：水射流 激光 硅 钻孔 动边界 

分 类 号：TN2[电子电信—物理电子学]