升温速率对Bi-2223带材载流性能的影响  

Effect of Heating Rate on the Critical Current of Bi-2223 Tapes

作　　者：郝清滨[1,2] 李成山[1] 郑会玲[1] 熊晓梅[1] 刘国庆[1] 杜明焕[1] 胡锐[2] 

机构地区：[1]西北有色金属研究院,陕西西安710016 [2]西北工业大学,陕西西安710072

出　　处：《稀有金属材料与工程》2008年第A04期205-208,共4页Rare Metal Materials and Engineering

基　　金：陕西省"13115"科技创新工程重大科技专项(2007ZDKG-45)

摘　　要：研究了第一次热处理中的升温速率对Bi2223带材特性的影响,分别采用100、300和500℃/h的升温速率将带材加热到838℃,于空气气氛中保温50h,后经中间轧制,第二次热处理得到成品带材。试验发现升温速率影响带材热处理的鼓泡特性,同时对Bi-2223相的转化率、残余第二相的含量及Bi-2223的晶粒取向也有一定的影响。采用适当的升温速率(300℃/h)可以限制带材的鼓泡,改善带材的微观组织并提高临界电流(Ic),77K自场下的Ic可达101A,磁场下的载流性能也有一定改善。The effects of heating rates （100, 300 and 500 ℃/h） on the critical current of Bi-2223 tapes were investigated during the first heat treatment at 838 ℃ for 50 h in air for the tapes by a two-step heat treatment process with one intermediate rolling. It is demonstrated that the effects are connected directly with the bubbling, the fraction of Bi-2223 phase, and the second phase and grain alignment of Bi-2223/Ag tapes. The heating rate of 300 ℃/h is the optimum for controlling the bubbling and improving the microstructure and critical current （Ic）. The tape heated at 300 ℃/h has a critical current of 101 A （77 K, self-field）, showing a better current carrying capability in magnetic fields.

关 键 词：Bi-2223超导带材 升温速率 临界电流 微观组织 晶粒取向 

分 类 号：TG146[一般工业技术—材料科学与工程]