衬底温度对射频磁控溅射制备Ti-Ni合金薄膜的影响  

Influence of In Situ Heating on TiNi Shape Memory Alloy Thin Films Deposited by RF Magnetron Sputtering

作　　者：曾光[1,2] 李子全[1] 周衡志[1] 董亚军[2] 

机构地区：[1]南京航空航天大学,江苏南京210016 [2]西北有色金属研究院,陕西西安710016

出　　处：《稀有金属材料与工程》2008年第A04期523-527,共5页Rare Metal Materials and Engineering

摘　　要：采用射频磁控溅射技术在石英玻璃上沉积TiNi薄膜,利用XRD、SEM、EDS、台阶仪和纳米压痕仪、划痕仪等测试方法研究了溅射态原位加热对TiNi薄膜的组织结构、化学成分及力学性能的影响。结果表明,溅射态原位加热至500℃可直接获得具有晶化织构的TiNi薄膜,其弹性模量为64.9GPa,变形能效率η为36.7%,薄膜与基体的临界结合力为35.26N。TiNi shape memory alloy thin films prepared by RF magnetron reaction sputtering in situ heating on quartz were investigated. The microstructure, composition and mechanical properties of TiNi thin films were studied by XRD, SEM, EDS, nano hardness tester and scratch test methods. Results show that the crystallized TiNi thin films can be prepared in situ heating at 500 ℃. The value of elastic modulus and transmutation ratio about the films are 64.9 GPa and 36.7%, respectively. The critical adhesion forces existing between the TiNi coatings and the quartz substrates is 35.26 N.

关 键 词：TiNi薄膜 原位加热 微观组织 力学性能 

分 类 号：TG139.6[一般工业技术—材料科学与工程] O484[金属学及工艺—合金]