热处理对立方织构Ni-5%(体积分数)W基带上Ag薄膜择优取向的影响  

Effects of heat treatment on the preferred orientation of Ag films on cube textured Ni-5at% W substrates

作　　者：李凤华[1] 王威[1] 李英楠[1] 罗清威[1] 单玉桥[1] 樊占国[1] 卢亚峰[2] 李成山[2] 

机构地区：[1]东北大学材料与冶金学院,辽宁沈阳110004 [2]西北有色金属研究院超导材料研究所,陕西西安710016

出　　处：《功能材料》2009年第11期1857-1859,1863,共4页Journal of Functional Materials

基　　金：国家科技部"十一.五"863项目(2008AA03Z202);国家自然科学青年基金资助项目(50702012);辽宁省博士启动资助基金(20071017)

摘　　要：采用磁控溅射法在立方织构Ni-5%(原子分数,下同)W基底上沉积了Ag薄膜作为第二代高温超导带材——YBaCuO涂层导体的导电缓冲层,并通过后期在Ar气氛下热处理使Ag膜具有(200)择优取向。磁控溅射后Ag膜的择优取向为(111),随着热处理温度的升高,(200)择优取向强度增加。采用慢降温工艺即在900℃下恒温30min,然后以较慢的速率10℃/h降至800℃后样品随炉冷却,有利于Ag薄膜由(111)向(200)的择优生长转变。As conductive buffer of the second generation high temperature superconductor tapes YBaCuO coated conductor,Ag films was heat treated in Ar atmosphere to grow in the （200） preferred orientation after magnetron sputtered on the cube textured Ni-5at%W substrates. The preferred orientation of magnetron sputtered Ag films was （111）. With the heat treatment temperature increasing, the preferred orientation of （200） was intensified. When Ag films were treated with the slow-cooling process . i. e. heating up to 900℃, then cooling in the rate of 10℃/h down to 800℃, finally furnace cooling,it is favorable for the transition of the preferred orientation of Ag film from （111） to （200）.

关 键 词：YBaCuO涂层导体 AG 择优取向 热处理 

分 类 号：TB43[一般工业技术] TF124.8[冶金工程—粉末冶金]