聚酰亚胺薄膜气相沉积的研究进展  

Advances in Vapor Deposition Polymerization Polyimide Films

作　　者：晁敏[1] 寇开昌[1] 吴广磊[1] 赵春玲[1] 王志超[1] 

机构地区：[1]西北工业大学理学院应用化学系,西安710129

出　　处：《材料导报》2009年第21期118-122,共5页Materials Reports

摘　　要：综述了气相沉积聚合设备、制备过程、影响因素、性能表征方法及近年来国内外的研究现状。气相沉积聚合聚酰亚胺薄膜相比于传统湿法成型具有纯度高、无溶剂、膜厚可控、致密均匀、可在复杂表面成型等优点。展望了气相沉积的应用以及今后的发展前景。Vapor deposition polymerization（VDP） from deposition equipment, deposition processes, influence factors, representation of properties and present research situation are summarized. Compared with tradition wet processes, films obtained by VDP have advantages such as higher purity, solventless, controllable film thickness, uniform and compact and can be shaped on complex surfaces. The applications and the future developments of VDP are prospected.

关 键 词：气相沉积聚合 聚酰亚胺薄膜 影响因素 性能表征 研究现状 应用 

分 类 号：TQ316.336[化学工程—高聚物工业] TM215.3[一般工业技术—材料科学与工程]