化学镀Ni-P-SiC复合镀层的研究进展  

Recent Progress in Electroless Ni-P-SiC Composite Plating

作　　者：沟引宁[1] 黄伟九[1] 薛燕[1] 

机构地区：[1]重庆理工大学材料科学与工程学院,重庆400050

出　　处：《材料导报》2009年第23期65-68,共4页Materials Reports

基　　金：重庆市教委科技研究项目(KJ070602);湘潭大学低维材料及其应用技术教育部重点实验室开放基金(KF0604);重庆工学院基金(2006ZD01)资助

摘　　要：综述了近年来国内外在Ni-P-SiC复合镀方面的研究进展,重点论述了SiC微粒的预处理、分散方式、SiC浓度、pH值、温度等工艺参数对镀速、复合镀层中粒子分布及含量的影响,讨论了复合镀层的硬度、耐磨性和耐蚀性能,最后指出了Ni-P-SiC复合镀应用中存在的问题和未来发展的方向。Advances in electroless Ni-P-SiC composite plating at home and abroad in recent years are reviewed. The pretreatment and concentration of SiC, dispersing method, pH, temperature, agitation methods on the deposition behavior of electroless composite films are focused. Several important properties, such as hardness, wear resistance and corrosion resistance are discussed. Finally, the existing problems and future development of electroless Ni-P-SiC are indicated.

关 键 词：Ni—P-SiC 化学复合镀 耐磨性 耐蚀性 

分 类 号：TQ153.2[化学工程—电化学工业]