Ti-Cu电阻钎焊接头微观性能研究  

Study on micro-performance of resistance brazing joint of Ti and Cu

作　　者：王希靖[1] 吴昌玉[1] 王锡龙[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室,甘肃兰州730050

出　　处：《电焊机》2009年第11期25-27,共3页Electric Welding Machine

摘　　要：为了克服现阶段电解镍生产过程中钛种板与铜耳铆钉连接的种种缺点,提出了应用电阻钎焊的方法连接钛种板与铜耳。在正交试验设计的参数下,经过多次实验成功实现了较大面积搭接试样的焊接;同时,利用SEM、EPMA等研究TC4与紫铜电阻钎焊接头组织,发现在适当焊接规范接头下,钎料与母材结合良好,钎料中主要金属原子与母材Ti和Cu能相互扩散、浸润,达到了原子间结合,焊缝组织无明显缺陷。In order to overcome the various disadvantanges of the rivet that titanium species plates and copper ear connect in the production process of electrolytic nickel now, this paper presents the method of resistance brazing to the connection of titanium species plates and copper ears.Under the parameters of orthogonal experimental design,we successfully carry out a large area of overlap welding through a series of tests.At the same time,we study the combination of welding joint through SEM,EPMA and so on. The analysis results show that ,with proper welding parameters ,the connection between titanium species plate and copper ear was good performance,diffudion and fusing happened between the main metal atoms of solder and the base metal Ti and Cu reached scopic interatomic and without defects.

关 键 词：电阻钎焊 焊接接头 扩散 微观性能 

分 类 号：TG425[金属学及工艺—焊接]