粉末冶金法制备新型铜基电接触材料的组织与性能分析  

Analysis on the Microstructure and Properties of New Copper-based Electrical Contact Material Produced by Powder Metallurgy Method

作　　者：崔浩[1] 谢明[1] 杨有才[1] 刘满门[1] 陈永泰[1] 刘捷[1] 张永甲[1] 

机构地区：[1]昆明贵金属研究所,云南昆明650106

出　　处：《新技术新工艺》2009年第11期98-99,共2页New Technology & New Process

基　　金：云南省自然科学基金资助项目(2005E0038Q)

摘　　要：利用粉末冶金法制备了新型铜基电接触材料,与传统熔铸方法制备的同类材料相比较,粉末冶金制品组织均匀、晶粒细小;显微硬度达到102.45HV,较熔铸法高7.12HV;电导率为28.58ms/m,较熔铸态样品下降了5.5ms/m;粉末冶金制品高温抗氧化性能优异。New Copper based electrical contact material is made by powder metallurgy method, the microstructure of powder metallurgical sample is homogenous and the grain size is smaller than those of the traditional melt casting. The micro hardness of the sample is 102.45HV, which is 7. 12 HV higher than that of the melt casting sample, and the electrical conductivity is 28.58 ms/m, which is 5.5 ms/m lower than that of the melt casting sample, meanwhile the high temperature oxidation-resistance property of powder metallurgical sample is good.

关 键 词：铜合金电接触材料 粉末冶金 微观组织 力学性能 电导率 

分 类 号：TF12[冶金工程—粉末冶金] TG113.22[冶金工程—冶金物理化学]