Buckling Analysis of Soft Nanostructure in Nanoimprinting  

作　　者：冯侃 励争 

机构地区：[1]State Key Lab for Turbulence and Complex Systems, College of Engineering, Peking University, Beijing 100871

出　　处：《Chinese Physics Letters》2009年第12期194-197,共4页中国物理快报（英文版）

摘　　要：Nanoimprint lithography is an economical and convenient method for manufacturing nanostructures, which has developed very quickly and has been widely used in the nanoindustry. However, during the process of nanoimprinting, mechanical instabilities of soft nanostructures could lead to buckling. In order to study the mechanism of this problem, we analyze the buckling of one vertical elastic column under its own weight. Based on the comparison between two critical heights of different substrates （rigid and elastic）, we conclude that the approximation of considering the substrate as rigid is acceptable. Furthermore the interaction between columns with the deformation of a substrate could lead to collective buckling. Our theoreticalcalculations show that whether the columns are elastic or rigid makes little difference for the buckling modes.Nanoimprint lithography is an economical and convenient method for manufacturing nanostructures, which has developed very quickly and has been widely used in the nanoindustry. However, during the process of nanoimprinting, mechanical instabilities of soft nanostructures could lead to buckling. In order to study the mechanism of this problem, we analyze the buckling of one vertical elastic column under its own weight. Based on the comparison between two critical heights of different substrates （rigid and elastic）, we conclude that the approximation of considering the substrate as rigid is acceptable. Furthermore the interaction between columns with the deformation of a substrate could lead to collective buckling. Our theoreticalcalculations show that whether the columns are elastic or rigid makes little difference for the buckling modes.

关 键 词：Chinese climate network complex systems small world community 

分 类 号：TN305.93[电子电信—物理电子学] TU323[建筑科学—结构工程]