SDC电解质致密化研究  

Study on Densification of SDC Electrolyte

作　　者：许亮[1] 侯书恩[1] 靳洪允[1] 赵新颖[1] 黄玉娟[1] 张涛[1] 

机构地区：[1]中国地质大学材料科学与化学工程学院,武汉430074

出　　处：《材料导报（纳米与新材料专辑）》2009年第2期313-315,324,共4页

摘　　要：以共沉淀-喷雾干燥法制备的Ce_(0.8)Sm_(0.2)O_(1.9)(SDC)粉体为原料,模压成型后高温烧结获得SDC电解质陶瓷片。研究模压成型过程中加压时间、压力大小以及烧结温度对烧结体致密度的影响,利用XRD和SEM分别对不同烧结温度获得的烧结体结构和表面形貌进行分析。研究表明,压力30MPa、加压时间30min后获得的坯体,随着烧结温度的升高,烧结体致密度呈上升趋势,烧结温度达到1450℃时进入烧结后期,烧结体具有较高的致密度。此外,通过测定烧结过程中坯体收缩率,对SDC电解质陶瓷片的烧结动力学进行了研究,从而确定SDC电解质致密化的烧结温度为1300～1500℃。The SDC electrolyte materials are prepared at high sintering temperature after molding using Sm2 O3 doped CeO2 powders which are prepared by the coprecipitation-spray drying method. The effects of the molding pressure, holding time and sintering temperature on densification are studied. The microstructure and structural property of the sintered SDC are analyzed by SEM and XRD. The results show that the relative density of sintered SDC increases with sintering temperature increasing after dry-pressing process under 30MPa pressure for 30min holding time, the sintered SDC has high relative density at 1450℃. In addition, the characteristics of sintering kinetic curves of SDC ceramic are studied by means of measuring shrinkage. The results confirm that sintering temperature of SDC densification is 1300-1500℃.

关 键 词：SDC粉体 模压成型 烧结温度 致密化 收缩率 

分 类 号：TB124[理学—工程力学]