电流密度对无刻蚀低温镀铁性能的影响  

Effects of Current Density on Properties of Low-Temperature Iron Plating without Pre-etching

作　　者：安宁[1] 

机构地区：[1]四川建筑职业技术学院土木工程系,四川德阳618000

出　　处：《电镀与环保》2009年第6期9-10,共2页Electroplating & Pollution Control

摘　　要：采用无刻蚀低温镀铁技术,研究电流密度对铁镀层主要性能的影响。运用电子扫描电镜、显微硬度计等测试方法对其进行性能检测。结果表明:其他条件相同,随电流密度增大,镀层沉积速率和显微硬度增大,最大值分别为209.17μm/h和5 554 MPa;腐蚀速率下降,最小值达到0.108 g/m2.h。镀层结合力良好。The effects of current density on the main properties of iron coating were investigated by using low-temperature iron plating technology without pre-etching.The properties of the iron coating were tested by electronic scanning electron microscopy,Vickers hardometer and other related testing means.The results show that if other conditions are the same,the deposition rate and micro-hardness rise along with the increasing of current density,the respective maximum value of which is 209.17 μm/h and 5 554 MPa. The corrosion rate descends, the minimum value is 0. 108 g/m2· h. The bonding strength isbetter.

关 键 词：低温镀铁 电流密度 沉积速率 显微硬度 结合力 

分 类 号：TQ153[化学工程—电化学工业]