HIC、MCM和SIP  

HIC,MCM ＆ SIP

作　　者：杨邦朝[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054

出　　处：《混合微电子技术》2009年第3期50-57,共8页Hybrid Microelectronics Technology

摘　　要：电子信息技术的发展推动与需求牵引，强烈地推进了电子整机与系统不断微小型化。各种先进封装与组装技术”武装”了各类电子整机与系统，二者互为需求与牵引、相互促进。其中HIC、MCM、SIP这三种技术起到了举足轻重的作用。本文主要对这三种技术特点及其相互关系进行了分析，指出了HIC未来的发展方向。With the development of electronic information technology , the electronic equipment and electronic systems become increasingly micro - miniaturization. A variety of advanced packaging and assembly technologies have achieved the kind of electronic equipments and electronic systems. Both of them are mutual promotion and demand. HIC, MCM and SIP have played an important role. In this paper, the characteristics of the three technologies and their interrelationships are analyzed and the direction of future development of HIC is pointed out.

关 键 词：HIC MCM SIP 

分 类 号：TN4[电子电信—微电子学与固体电子学]