刷镀镍-磷镀层的生长模型研究  

Growth Model of Ni-P Layer by Brush Plating

作　　者：罗建东[1] 曾德长[1] 张弢[2] 

机构地区：[1]华南理工大学机械与汽车工程学院,广东广州510640 [2]怀集登云汽车配件股份有限公司,广东怀集526400

出　　处：《表面技术》2009年第6期6-8,75,共4页Surface Technology

基　　金：广东省产学研项目(2007B090200027)

摘　　要：以目前应用最广泛的刷镀镀层之一——镍-磷镀层为对象,利用自制多功能刷镀电源、原子力显微镜等设备,测得了刷镀时间与刷镀电流之间的关系,通过数据处理求得了二者之间的函数关系,在此基础上进一步求得了电流密度(刷镀电流/刷镀面积)与刷镀时间之间的函数关系;利用原子力显微镜测得镀层界面处、接近界面处和远离界面处的镀层颗粒形貌,结合刷镀电流密度与刷镀时间之间的关系,建立了刷镀镀层生长的模型。模型具有重要的指导意义:根据所建立的模型可以控制镀层颗粒的大小,改善镀层质量,为实际生产提供参考和指导。The most widely used Ni-P coating by brush plating was researched. In the experiment, a self-made muhi-purpose brush power, atomic force microscope （AFM）and other equipment were used, the correlation of plating time and plating current was measured, and the function was also obtained. According to the function, the correlation of current density that plating current devide by plating area and plating time was obtained. The particle morphologies in coating interface, close to the interface and away from the interface were measured by the AFM. Combined with the rela- tionship between plating current density and plating time, the mechanism of coating growth model was established. The model is significance to control the coating structure. The purpose of the paper is providing reference for production applacation by the model to control plating layer quality.

关 键 词：刷镀 镍-磷镀层 生长机理 镀层模型 

分 类 号：TQ153.2[化学工程—电化学工业]