Cu离子注入不锈钢的分子动力学模拟研究  

Molecular Dynamic Simulation for Cu Ion Implantation in A304 Stainless Steel

作　　者：高晓晋[1] 陈敬超[2] 于杰[2] 邹妤[2] 

机构地区：[1]昆明冶金高等专科学校社会科学与公共学院,云南昆明650033 [2]昆明理工大学材料与冶金工程学院,云南昆明650093

出　　处：《昆明冶金高等专科学校学报》2009年第5期1-4,共4页Journal of Kunming Metallurgy College

基　　金：云南省应用基础研究:面上项目(2006E0019Q)

摘　　要：采用Lennard-Jones和Morse势函数对Cu离子溅射不锈钢进行了溅射过程与饱和溅射剂量的分子动力学模拟。模拟结果表明:在溅射过程中,Cu将铁从其位置替换,或者在其间隙位置存在;表层Fe发生了晶格损伤,以一种无定型态存在;而扩散模型中,材料的表层发生了Cu的富集现象,X射线检测表明,该富集相为Cu3Fe4和Cu4Fe。The implantation process was simulated through molecular dynamic soft and the model was conducted by Lennard -Jones and Morse potential function. The result showed that during implanting process, Cu took the place of Fe, or existed in a gap location. The surface lattice of Fe was damaged and being in a amorphous condition. While in the diffusion model, enrichment phenomenon of Cu occurred. X- ray showed that phase was Cu3Fe4 and Cu4Fe.

关 键 词：Cu离子注入 抗菌 不锈钢 分子动力学 

分 类 号：TB331[一般工业技术—材料科学与工程]