环氧灌封料固化反应动力学及其性能研究  

Study on curing reaction kinetics and properties of epoxy potting compound

作　　者：许亮[1] 侯书恩[1] 靳洪允[1] 赵新颖[1] 黄玉娟[1] 

机构地区：[1]中国地质大学材料科学与化学工程学院,湖北武汉430074

出　　处：《热固性树脂》2009年第6期26-29,共4页Thermosetting Resin

摘　　要：采用非等温示差扫描量热法(DSC)研究了环氧树脂(E-51)/甲基四氢苯酐/DMP-30/球形SiO2体系的固化反应动力学,采用Kissinger法和Crane公式对体系的DSC数据进行了处理,获得了固化反应动力学参数,确定了固化工艺。同时通过力学性能和热性能测试研究了球形SiO2添加量对复合材料性能的影响。结果表明,SiO2质量分数为10%的体系其起始固化温度为109.7℃,峰顶固化温度为134.8℃,终止固化温度为154.3℃;较好的固化工艺为100℃/2 h+140℃/2 h+160℃/2 h。该体系反应级数n=0.917,表观活化能Ea=78.52 kJ/mol。当SiO2添加量为30%时,其弯曲强度达到最大值97 MPa,同时热分解温度达到最大值332℃,试样热膨胀系数也明显降低。The curing reaction kinetics of E -51/MeTHPA / 2, 4, 6 - three （ dimethy laminemethyl） phenol （ DMP -30） / spherical silica was studied by differential scanning calorimetry （DSC）. The curing reaction kinetic parameters were obtained by data processing of Kissinger method and Crane formula. The curing process were determinated. The effect of SiO2 content on the properties of the composite was invesigated by the mechanical and thermal property tests. The results showed that the initial curing temperature, peek tempeteture and termination curing temperature were 109. 7 ℃, 134. 8 ℃and 154. 3 ℃ respectively. The optimal curing process was as follows ：100 ℃/2 h ＋ 140 ℃/ 2 h ＋ 160 ℃/2 h . The curing reaction order n =0. 917 and the apparent activation energy Ea =78.52 kJ/mol. The flexural strength and thermal decomposition temperature of the system with 30% SiO2 reached the maximum 97 MPa and 332 ℃ respectively . The thermal expansion coefficient was also decreased obviously.

关 键 词：环氧灌封料 球形SiO2 固化反应动力学 复合材料 力学性能 热性能 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]