导通孔和通孔填孔镀用的CuSO_4电镀工艺“Cu-BRITE TFⅡ”  

Cupric Sulfate Plating Process Cu-BRITE TFⅡ for Through-Hole and Via Filling Plating

作　　者：蔡积庆（编译） 

机构地区：[1]江苏南京210018

出　　处：《印制电路信息》2009年第12期38-42,共5页Printed Circuit Information

摘　　要：概述了CuSO4电镀工艺"CU-BRITE TFⅡ"的开发和特性,适用于镀铜层填充导通孔和贯通孔。This paper describes the development and characteristic of CuSO4 electroplating process ＂Cu-BRITE TFⅡ＂ ,it is suitable for via filling and through holoe filling using electroplating copper plating.

关 键 词：导通孔填充 贯通孔填充 CuSO4电镀工艺 Cu-BRITE TFⅡ 

分 类 号：TN41[电子电信—微电子学与固体电子学]