锦纶织物化学镀铜研究  

Study on Planting Chemical Copper on Polyamide Fabric

作　　者：徐欣[1] 沈兰萍[1] 陈利梅[1] 

机构地区：[1]西安工程大学纺织与材料学院,陕西西安710048

出　　处：《纺织科技进展》2009年第6期35-36,43,共3页Progress in Textile Science & Technology

摘　　要：对锦纶织物的化学镀工艺进行了研究,详述了粗化、活化、解胶、还原、中和与施镀工序的工艺条件,并对化学镀织物性能进行了测试分析。Chemical planting process on polyamide fabric was studied. The technological conditions of processes which are coarsening, activation, dispergation, planting the fluid ingredient etc. were analysed and the properties of fabric after being planted were also tested and analysed.

关 键 词：锦纶织物 化学镀 工艺条件 屏蔽效能 

分 类 号：TS195.5[轻工技术与工程—纺织化学与染整工程]