二次冷轧镀锡板的合金-锡电偶合研究  

Studies on the alloy-tin couple for the double reduced tinplate

作　　者：黄先球[1,2] 柳长福[1] 刘海军[3] 白会平[1] 魏远征[3] 涂元强[1] 郭玉华[1] 

机构地区：[1]武钢研究院,湖北武汉430080 [2]浙江大学化学系,浙江杭州310027 [3]武钢生产技术部,湖北武汉430083

出　　处：《武钢技术》2009年第6期9-11,共3页Wisco Technology

摘　　要：采用电化学方法研究武钢研制的二次冷轧镀锡板合金-锡电偶合ATC值和合金锡量,并利用扫描电镜观察合金层的形貌。研究结果表明,武钢二次冷轧镀锡板ATC平均值≤0.12μA/cm2,合金锡量在0.9 g/m2以上,合金层形貌致密连续,ATC值达到国标GB/T 2520-2008和美国标准ASTM A623M-06a合金-锡电偶合指标要求。The alloy-tin couple （ATC） value, the alloy-tin quantity and the morphology of the alloy layer of the double reduced tinplate produced in WISCO were studied using electro-chemical methods in conjunction with observation of scanning electron microscopy （SEM）. The results showed that average ATC value of the double reduced tinplate was no more than 0. 12 μA/cm^2 , the alloy tin quantity was more than 0. 9 g/m^2, the morphology of the alloy layer was consistent and dense, and ATC value of the double reduced tinplate met the national standard GB/T 2520-2008 and the United States standard ASTM A 623M-06a.

关 键 词：二次冷轧 镀锡板 合金-锡电偶合 

分 类 号：TG174.44[金属学及工艺—金属表面处理]