FeS/Cu材料动态再结晶行为与性能研究  

Study on Dynamic Recrystallization Behavior and Performance of FeS/Cu Composites

作　　者：于杰[1,2] 陈敬超[2] 张尧翠 洪振军[2] 

机构地区：[1]昆明理工大学材料与冶金学院,云南昆明650093 [2]昆明理工大学稀贵及有色金属先进材料教育部重点实验室云南省新材料制备与加工重点实验室,云南昆明650093 [3]包头科锐工贸有限公司,内蒙古包头104032

出　　处：《热加工工艺》2009年第22期93-95,共3页Hot Working Technology

基　　金：云南省自然科学基金资助项目(2006E0019Q);国家科技支撑计划重大项目(2008CB617609)

摘　　要：研究了原位合成15%FeS/Cu复合材料在热挤压过程中的动态再结晶行为以及该行为对其性能的影响规律。结果表明,由于FeS/Cu复合材料在挤压过程中,内部受力不均,其再结晶主要通过亚晶迁移机制和凸出形核机制两种方式进行。另外,在累积真应变4.0前后,硬度和导电率的变化表现为相反的变化趋势,主要是由于加工硬化和再结晶软化在复合材料内部所占比例不同决定的。The influence of dynamic recrystallization and microstructure on the properties of FeS/Cu composites were analyzed in different hot extrusion processes. The results show that as a result of the uneven distribution of loading in the extrusion process, the nucleation mechanisms of dynamic recrystallization of the composite are the subgrain migration mechanism and the bulge nucleation mechanism, the pre and post cumulate true strain was 4.0, the hardness and electrical conductivity of the composite are different and the change trend are contrary, because of the different proportion of work hardening and dynamic recrystallization softening in the composites; to analysis on the effects of dynamic recrystallization on the performance are important to choose the optimum process.

关 键 词：FeS/Cu复合材料 动态再结晶 形核机制 硬度 导电率 

分 类 号：TB331[一般工业技术—材料科学与工程]