基于MSP430单片机的同步串行SPI多通道温度测试系统设计  

Multi-channel temperature test system based on MSP430 MCU synchronous serial SPI

作　　者：吴晓宇[1] 孙瑞杰[1] 崔春生[1] 裴东兴[1] 

机构地区：[1]中北大学电子测试技术国家重点实验室仪器科学与动态测试教育部重点实验室,山西太原030051

出　　处：《电子测试》2009年第12期35-38,共4页Electronic Test

摘　　要：文中介绍了基于MSP430单片机的同步串行SPI的多通道温度测试系统的设计方案。该系统主要由TI公司的MSP430F1611单片机等芯片构成。介绍了SPI的通信原理和实际系统的工作原理,结合实际着重阐述了系统的硬件设计和软件设计,最后,用VB设计的软件验证了设计方案的可行性并且给出了实验的结果。实验结果表明,该系统控制方便、工作稳定,能实现可靠的实时数据传输,在工程实践中具有重大的应用价值。The paper introduces the design scheme of the muti-channel temperature test system based on MSP430 MCU synchronous serial SPI. The system is consist of MSP430F1611 chip of TI company, etc..This paper introduces the comunication scheme of synchronous serial SPI and analyses the working principle of test system, focus on the hardware and software designs according to practical application, Finally, using the designed VB software verify the feasibility of the design. Experiments proved that the system is easy to control and works stably to perform reliabl realtime data transmission. The method have great value in engineering.

关 键 词：MSP430 同步串行SPI 温度 

分 类 号：TP274[自动化与计算机技术—检测技术与自动化装置]