无氰镀铜的实验研究与生产应用进展(二)  

Advances in experimental study and production practice of cyanide-free copper plating——Part Ⅱ

作　　者：袁诗璞 

机构地区：[1]成都市机投镇会所花园A3—02-202,四川成都610045

出　　处：《电镀与涂饰》2009年第12期9-13,共5页Electroplating & Finishing

摘　　要：总结了无氰碱铜试验与生产中应注意的问题,包括阴、阳离子杂质的影响,采用高纯度化工材料的必要性,提高抗杂质干扰的有效办法,以及锌压铸件滚镀无氰碱铜的特殊性。介绍了HEDP镀铜在工业化滚镀中的成功应用。评价了一价铜盐无氰碱铜初步试验的结果。Some problems needing attention in test and production of cyanide-free copper plating were summarized, including the effects of impurity cations and anions, the necessity of using highly-pure chemicals, the effective methods for eliminating interference of impurities, and the particularity of cyanide-free copper barrel plating on zinc die castings. The successful industrial application of HEDP copper barrel plating was introduced. The preliminary test results of cyanide-free copper plating using cuprous salts were evaluated.

关 键 词：无氰碱性镀铜 杂质 锌压铸件 滚镀 羟基乙叉二膦酸 一价铜 

分 类 号：TQ153.14[化学工程—电化学工业]