CuCGA器件焊点热疲劳行为数值模拟  

Numerical simulation on thermal fatigue behavior of CuCGA soldered joints

作　　者：肖正香[1] 薛松柏[1] 金春玉[2] 张亮 皋利利[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016 [2]黑龙江大学数学科学学院,哈尔滨150080

出　　处：《焊接学报》2009年第12期77-81,共5页Transactions of The China Welding Institution

基　　金：2009年南京航空航天大学博士学位论文创新与创优基金资助项目(BCXJ09-07);2009年江苏省普通高校研究生科研创新计划资助项目(CX09B-074Z);2006年江苏省"六大人才高峰"资助项目(06-E-020)

摘　　要：基于蠕变模型构建Sn3.9Ag0.6Cu和63Sn37Pb钎料的本构方程,分析铜柱栅阵列封装(CuCGA)器件在不同温度循环载荷下焊点的应力应变分布.结果表明,不论温度循环如何变化,距器件中心最远处焊点的等效蠕变值总是最大,且均有明显的应力集中现象,在热循环作用下,很容易在该焊点处最先产生裂纹,导致器件失效,是整个器件最脆弱的焊点.同样温度载荷下,Sn3.9Ag0.6Cu焊点的应力应变总是小于63Sn37Pb焊点,而随着温度循环范围的减小,两种钎料的应力和蠕变值均有所降低.另外,预测发现同样温度循环载荷条件下Sn3.9Ag0.6Cu焊点具有较高的疲劳寿命.The constitutive equation of Sn3.9Ag0.6Cu and 63Sn37Pb were established based on creep law,and the stress-strain distribution of soldered joints in copper column grid array(CuCGA) devices was analyzed under the loadings of different temperature cycles.Results indicate that no matter how the change of temperature cycle range,the maximum creep strain is located in the soldered joint where the location from the device center is foremost,in which the stress concentration is found and cracks appear,therefore,the corner soldered joint is the most fragile area in the whole device.Creep strain of Sn3.9Ag0.6Cu soldered joints is smaller than that of 63Sn37Pb soldered joints.Lower stress and creep strain are exhibited for both Sn3.9Ag0.6Cu and 63Sn37Pb when the temperature cycles range is shortened.Sn3.9Ag0.6Cu soldered joints show higher thermal fatigue life than 63Sn37Pb soldered joints under the same temperature cycle.

关 键 词：铜柱栅阵列 可靠性 蠕变模型 疲劳寿命 

分 类 号：TG115.28[金属学及工艺—物理冶金]