聚酰亚胺/二氧化硅复合薄膜的热物性及其影响因素  

Thermophysical properties and influencing factors of polyimide/silica composite films

作　　者：杨莉萍[1] 蔡岸[1,2] 雒彩云[1] 陈江平[2] 奚同庚[1] 

机构地区：[1]中国科学院上海硅酸盐研究所,上海200050 [2]上海交通大学制冷与低温工程研究所,上海200240

出　　处：《材料研究学报》2009年第6期587-591,共5页Chinese Journal of Materials Research

基　　金：国家自然科学基金50706057资助项目~~

摘　　要：应用自行研制的亚微米/微米薄膜激光脉冲法热扩散率测定仪和差示扫描量热仪(DSC)分别测定了聚酰亚胺(PI)薄膜和PI/SiO_2复合薄膜在不同温度下的热扩散率、热导率和比热,解决了激光脉冲法测定热导试样的透光问题.研究了PI/SiO_2复合薄膜的热物性随SiO_2添加量和温度的变化关系.结果表明:随着温度的升高,PI薄膜及PI/SiO_2复合薄膜的热扩散率下降,比热和热导率线性增加.在PI薄膜中添加SiO_2颗粒可降低PI薄膜的比热,明显增强导热性能,但是不会改变PI薄膜热导率随温度升高而增大的变化规律.Thermal diffusivities, thermal conductivities, and specific heats of PI film and PI/SiO2 composite film at different temperatures were measured by laser flash method and differential scanning calorimeter（DSC）. The light transmission problem of thin films in the procession of testing thermal diffusivity by laser flash method was solved effectively. The influences of temperature and silica content on thermophysical properties of PI/SiO2 composite films were investigated. The results showed that thermal diffusivities of PI and PI/SiO2 decreased, and specific heats and thermal conductivities increased with increasing temperature. The addition of the silica could result in the decrease of specific heats and the obvious enhancement of thermal conductivities, but the trend that the thermal conductivity of PI film increases with increasing temperature would not be changed, which is inherent in amorphous materials.

关 键 词：复合材料 热物性 激光脉冲法 PI/SiO2薄膜 

分 类 号：TB332[一般工业技术—材料科学与工程]