硫酸盐还原菌(SRB)固定化技术处理镀铜、镀铁混合电镀废水的研究  

Study on Treatment of Electroplating Waste-water with Immobilized SRB

作　　者：张新宇[1] 李科林[1] 

机构地区：[1]中南林业科技大学,湖南长沙410004

出　　处：《精细化工中间体》2009年第6期47-49,共3页Fine Chemical Intermediates

摘　　要：通过对污水处理厂的剩余污泥进行厌养培养,获得硫酸盐还原菌(SRB)占优势的厌养污泥,利用固定化技术对富含SRB的污泥进行包埋固定,制得SRB固定化小球。考察了在不同pH值、温度、COD/SO42-等条件下,SRB固定化小球处理镀铜、镀铁混合电镀废水的效果。结果表明:pH值为7,温度为35℃,COD/SO42-比值为3时,铜、铁的去除率分别可达到99.9%、98.8%以上。Waste sludge from sewage treatment plant was cuhivated so as to getting activated sludge containing mainly SRB. The sludge was immobilized in small particles. With immobilized SRB, the particles were used for treating electroplating wastewater containing copper and iron. The removal rate of copper and iron ions were 99.9% and 98.8%, respectively, under the conditions ofpH 7, 35℃ and the ratio of COD/SO4 2- at 3.

关 键 词：电镀废水 硫酸盐还原菌(SRB) 剩余污泥 固定化技术 

分 类 号：TQ085.1[化学工程]