基体负偏压对TiAlN/TiN膜层组织成分及硬度的影响  

Effects of Pushed Bias on Microstructure and Hardness of TiAlN/TiN Coating

作　　者：卢龙[1] 蒋涛[2] 严铿[2] 

机构地区：[1]淮海工学院机械工程学院,江苏连云港222005 [2]江苏科技大学材料学院,江苏镇江212003

出　　处：《热加工工艺》2009年第24期78-80,83,共4页Hot Working Technology

基　　金：重庆大学机械传动国家重点实验室访问学者基金资助项目(FX-04384758);国家自然科学基金国际合作交流项目NSFC-KOSEF(50611140547)

摘　　要：采用多弧离子镀技术在40Cr基体上制备TiAlN/TiN复合膜层;利用金相显微镜、扫描电子显微镜和显微硬度仪研究基体负偏压对膜层硬度的影响。结果表明:基体负偏压对膜层性能有显著影响,过高或过低的基体偏压会使得膜层表面不平整,表面显微硬度降低。基体负偏压越高,膜层中Ti、Al原子的含量就越低。40Cr steel substrate was coated with TiAlN/TiN films by multi-arc ion technology. The effects of pushed bias on microstructure and hardness of TiAlN/TiN coating were studied with metallographic microscope, SEM and microhardness instrument. The results show that the pushed bias has a great influence on performance of TiAlN/TiN films. The excessive high pushed bias can make the surface of films out of flatness and reduce the hardness of films. The content of Ti and Al in films becomes lower if the pushed bias becomes more higher.

关 键 词：多弧离子镀 TIALN TIN 

分 类 号：TG174.44[金属学及工艺—金属表面处理]