PIP法制备SiC_f/SiC复合材料导热性能影响因素研究  

Effects on the Thermal Conductivity Properties of SiC_f/SiC Composites Manufactured by PIP Process

作　　者：王亦菲[1] 刘伟峰[1] 马青松[1] 

机构地区：[1]国防科学技术大学CFC重点实验室,湖南长沙410073

出　　处：《稀有金属材料与工程》2009年第A02期466-469,共4页Rare Metal Materials and Engineering

基　　金：武器装备预研基金(514142030505KG0165)

摘　　要：以国产连续SiC纤维和聚碳硅烷(PCS)为原料,采用先驱体转化法(PIP)制备了系列SiCf/SiC陶瓷基复合材料(SiCf/SiC-CMC)。采用激光导热仪、扫描电镜(SEM)等分析手段初步研究了热处理温度、纤维铺排方式、碳涂层、纤维体积含量、孔隙率等因素对SiCf/SiC-CMC结构和导热性能的影响。结果表明:热处理温度越高,SiCf/SiC-CMC导热性能越好;纤维铺排方式对于导热性影响不大,而与热流传递的方向有关。增加纤维体积含量可以提高复合材料的导热性能,但碳涂层引入后SiCf/SiC-CMC导热性能明显降低。应尽量提高SiCf/SiC-CMC的致密化程度,以提高其导热性能。In this paper, the SiCf/SiC-CMCs were prepared by PIP process with continous SiC fibers and polycarbosilane（PCS）. The effects of the heat treatment temperature, the arrangement of fibers, carbon coating, fibers volume fraction and porosity on the thermal conductivity properties of the SiCf/SiC-CMCs were systematically researched by laser flash method, SEM, and energy spectrum analysis. The results showed that the thermal conductivity properties of the SiCf/SiC-CMCs increase with raising the heat treatment temperature. The arrangement of fibers but heat flow direction has little effect on the thermal conductivity of SiCf/SiC-CMCs, with can be improved by increasing fiber volume fraction but decreased by treatment with carbon coating. The thermal conductivity of the SiCf/SiC-CMCs increases with dcreasing porosity. The densification of the SiCf/SiC-CMCs should be as high as possible in order to improve the thermal conductivity.

关 键 词：PIP法 SICF/SIC 导热性能 

分 类 号：TB332[一般工业技术—材料科学与工程]