Thermal and mechanical characterizations of a substrate-free focal plane array  

Thermal and mechanical characterizations of a substrate-free focal plane array

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作  者:程腾 张青川 陈大鹏 史海涛 高杰 钱剑 伍小平 

机构地区:[1]CAS Key Laboratory of Mechanical Behavior and Design of Materials,University of Science and Technology of China [2]Institute of Microelectronics,Chinese Academy of Science

出  处:《Chinese Physics B》2010年第1期222-233,共12页中国物理B(英文版)

基  金:Project supported by the National Natural Science Foundation of China (Grant Nos. 10732080 and 10627201);the National Basic Research Program of China (Grant No. 2006CB300404)

摘  要:We propose a substrate-free focal plane array (FPA) and the microcantilevers extend from a supporting frame. in this paper. The solid substrate is completely removed, Using finite element analysis, the thermal and mechanical characterizations of the substrate-free FPA are presented. Because of the large decrease in thermal conductance, the supporting frame is temperature dependent, which brings out a unique feature: the lower the thermal conductance of the supporting frame is, the higher the energy conversion efficiency in the substrate-free FPA will be. The results from the finite element analyses are consistent with our measurements: two types of substrate-free FPAs with pixel sizes of 200×200 and 60×60 um^2 are implemented in the proposed infrared detector. The noise equivalent temperature difference (NETD) values are experimentally measured to be 520 and 300 mK respectively. Further refinements are considered in various aspects, and the substrate-free FPA with a pixel size of 30×30 um^2 has a potential of achieving an NETD value of 10 mK.We propose a substrate-free focal plane array (FPA) and the microcantilevers extend from a supporting frame. in this paper. The solid substrate is completely removed, Using finite element analysis, the thermal and mechanical characterizations of the substrate-free FPA are presented. Because of the large decrease in thermal conductance, the supporting frame is temperature dependent, which brings out a unique feature: the lower the thermal conductance of the supporting frame is, the higher the energy conversion efficiency in the substrate-free FPA will be. The results from the finite element analyses are consistent with our measurements: two types of substrate-free FPAs with pixel sizes of 200×200 and 60×60 um^2 are implemented in the proposed infrared detector. The noise equivalent temperature difference (NETD) values are experimentally measured to be 520 and 300 mK respectively. Further refinements are considered in various aspects, and the substrate-free FPA with a pixel size of 30×30 um^2 has a potential of achieving an NETD value of 10 mK.

关 键 词:focal plane array infrared detectors substrate-free UNCOOLED 

分 类 号:TN215[电子电信—物理电子学] TN65

 

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