面向元器件重用的印制电路板拆解试验  

Experiments on Reuse-oriented Disassembly of Components from Printed Circuit Boards

作　　者：杨继平[1,2] 向东[1] 程杨[1] 高鹏[1] 段广洪[1] 冯剑[2] 

机构地区：[1]清华大学精密仪器与机械学系,北京100084 [2]后勤工程学院供油工程系,重庆400016

出　　处：《机械工程学报》2010年第1期134-139,共6页Journal of Mechanical Engineering

基　　金：国家科技支撑计划(2006BAF02A16);重庆市科技攻关(CSTC;2007AC2063)资助项目

摘　　要：研究面向元器件重用的废旧印制电路板拆解工艺和拆解设备,需要分析评价不同拆解参数对印制电路板元器件拆解效率和已拆解元器件的重用性的影响。以废旧计算机主板为例,进行三种拆解施力方法和四种不同加热参数下的印制电路板拆解试验,在自制的印制电路板拆解试验样机及试验设备上测试并分析了印制电路板上元器件的分离率和已拆解元器件的可重用合格率。试验表明,采用接触式冲击、非接触式冲击和振动三种拆解施力方式对于贴片元器件和直引脚插装元器件均有良好的拆解效果;为了提高废旧印制电路板元器件的分离率,应重点提高接插件的分离率;为了提高元器件的可重用合格率,应主要考虑提高100脚以上贴片元器件的可重用合格率;在试验条件下以元器件分离率为试验指标时,得到了拆解元器件加热参数最佳水平的分布范围。试验还表明,较小的冲击势能有利于保证元器件较高的可重用合格率。以上试验结果为确定面向元器件重用的印制电路板拆解工艺提供了依据,也为研制废旧印制电路板拆解设备奠定了试验基础。In order to realize reuse-oriented disassembly of components from printed circuit boards（PCB） and develop PCB disassembly process and apparatus, it is necessary to analyze and evaluate the influences of various parameters on reusability and disassembly efficiency of components. Mainboards of scraped computers are taken as samples, experiments are performed with three kinds of removal forces and four kinds of heating parameters on a pilot disassembly apparatus under the conditions of hot air heating, and the disassembly efficiency of components is analyzed and the disassembled components are evaluated for reuse. The experiments show that it has a high components disassembly ratio （CDR） for SMDs and THDs with unclinched pins under three kinds of removal forces （contact impact, non-contact impact and vibration）. To improve the components disassembly ratio of waste PCBs, the disassembly ratio of slot and connectors should be concentrated on. To improve the reusability ratio of disassembled components, the reusability of IC chips with more than 100 pins should be regarded mainly. In addition, the optimal level range of heating parameters is analyzed with the purpose of better disassembly ratio. The results also show that small impact potential energy is favorable to a high reusability. These experiments provide the basis for determining the reuse-oriented disassembly process of components and also for developing the disassembly apparatus.

关 键 词：废旧印制电路板 拆解工艺 再使用 资源化 

分 类 号：X705[环境科学与工程—环境工程]