银基触头材料裂纹类型及形成机理研究  

Study on Crack Types and their Formation Mechanismsof Silver Based Contact Materials

作　　者：郭凤仪[1] 王其平[1] 孙鹤旭[2] 

机构地区：[1]西安交通大学 [2]辽宁工程技术大学

出　　处：《电工技术学报》1998年第4期47-51,56,共6页Transactions of China Electrotechnical Society

基　　金：国家自然科学基金

摘　　要：根据不同电流等级及不同触头闭合压力，对银基触头材料裂纹类型及形成机理进行了分析研究。通过实验研究和理论分析，提出了三种裂纹类型并分析了每种裂纹的形成机理。The study on crack types and their formation mechanisms of silver based contact materials are carried out according to the various currents and various contact closed forces.By analyzing the experimental results,three types of cracks are presented and their mechanisms are discussed.

关 键 词：银基触头材料 接触压力 裂纹 形成 电触头 

分 类 号：TM503.5[电气工程—电器]