聚苯基甲氧基硅烷及其改性环氧树脂的合成与性能  

Synthesis of Polyphenylmethoxy Silicone Modified Epoxy Resins

作　　者：李因文[1,2] 沈敏敏[1] 马一静[1,2] 黄活阳[1,2] 哈成勇[1] 

机构地区：[1]中国科学院纤维素化学重点实验室,广州化学研究所,广东广州510650 [2]中国科学院研究生院,北京100039

出　　处：《高分子材料科学与工程》2010年第1期22-25,共4页Polymer Materials Science & Engineering

基　　金：广东省关键领域重点突破项目(2006A25002002);广东省自然科学基金研究团队项目(E06200692)

摘　　要：苯基三甲氧基硅烷和二苯基二甲氧基硅烷水解合成了聚苯基甲氧基硅烷(PPMS),通过正交实验讨论了水的用量、催化剂用量、反应时间和温度对合成聚苯基硅氧烷的影响,并确定了最佳合成工艺。然后用其改性E-20环氧树脂,通过环氧值、红外光谱分析表明PPMS接枝了环氧树脂且环氧基保持不变。用差示扫描量热(DSC)、热重(TGA)分析了有机硅含量对改性树脂耐热性能的影响。结果表明,当m(E-20):m(PPMS)=7:3时,改性树脂固化物的耐热性能明显提高,玻璃化转变温度(T_g)为95.81℃,质量损失50%时的热分解温度(T_d)为476.54℃,分别比改性前提高了8.97℃和58.26℃,同时还具有优良的涂膜性能。Polyphenylmethoxy silicone （ PPMS ） was synthesized by the hydrolysis-condensation of phenyltrimethoxysilone and dimethoxydiphenylsilone. The influences of the amount of water and catalyst, reaction time and temperature on the product were investigated by orthogonal experiment and a better synthetic condition was obtained. Then E-20 epoxy resin was modified by PPMS. Epoxy value and IR indicated that PPMS was incorporated into epoxy resin, and oxirane ring was intact during the reaction procedure. The influence of Silicone contents on the heat-resistant properties was investigated by differential scanning calorimetry （DSC） and thermogravimetry analysis （TGA）. The results show the heat-resistance of the chemical modified epoxy resins improves obvious when the mass ratio of epoxy resin to PPMS is 7：3, Glass transition temperature（Tg） is 95.81 ℃, the 50% mass loss temperature of degradation （Ta） is 476.54 ℃, higher than those of unmodified epoxy resin by 8.97℃ and 58.26 ℃ respectively, and the film coatings show excellent filming properties.

关 键 词：苯基三甲氧基硅烷 二苯基二甲氧基硅烷 环氧树脂 改性 耐热性 

分 类 号：TQ324.21[化学工程—合成树脂塑料工业]